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RDF(Reduced Defocus) Stepper/Scanner Chuck
The Purpose of Up-Grade
Decrease Local Defocus
Cost Reduction
Fast Delivery time
General Concepts
Extended Vacuum Area
Changed Pin Pattern(Diamond shape)
Reduced Vacuum Ring Q’ty
Increase the height of Vacuum Ring
Benefits
After the switch to RDF chuck,
improved on Edge Defocus problem.
Tilt Range
on the full surface of wafer has been reduced
(31% improved)
Expecting a
better result on yield
due to the enlarged the vacuum ring size Yield.
Approximately
30% reduced on price
for each chuck.
Benefits
Delivery : 8 Weeks ARO
Warranty : Same as Original
Pricing : Contact to SNT-USA
Cleaning tool
Original
New
Outer size
Ø 28mm
Ø 50mm
Materials
AL2O3
99.99% SIC
SIC : Reduced pin break possibility-> Larger outer size
Quick cleaning ->Strong material
Copyright © 2003 SNT-USA, Inc. All rights reserved.
Spare Parts
Ceramic
Silicon
Quartz
Aluminum
SIC Dummy Wafer
Engineering Plastics - O-Rings
Heater Blocks
Tool Refurbishments
Ceramic ESC Refurbishment
Upgrade Stepper& Scanner chuck
Maintenance & Services
